Wiring Board - 企業ランキング(全34社)
更新日： 集計期間:Oct 15, 2025〜Nov 11, 2025
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企業情報を表示
| 会社名 | 代表製品 | ||
|---|---|---|---|
| 製品画像・製品名・価格帯 | 概要 | 用途/実績例 | |
| 【R-1766 Specifications (Partial)】 ■Substrate Manufacturer: Panasonic ■UL/ANSI Grade: FR-4.0 ■Main Applications: Communication, Automotive, e... | For more details, please refer to the PDF document or feel free to contact us. | ||
| 【Features】 〇 Flattening of surface mount pads by partial filling only in the BGA/CSP area (supports up to 0.35mm pitch) 〇 Permanent filling ... | 【Applications】 〇 Printed circuit boards (multilayer boards, BGA/CSP high-density boards, flat through-holes, aluminum boards, and other spec... | ||
| 【Other Printed Circuit Board Specifications】 <Manufacturable Layers and Board Thickness> ■ Layers: Single-sided, Double-sided, Multi-layer (... | For more details, please refer to the PDF document or feel free to contact us. | ||
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スクリーンプロセス
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- 代表製品
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<Super Short Delivery Time> Base Material Specification Sheet
- 概要
- 【R-1766 Specifications (Partial)】 ■Substrate Manufacturer: Panasonic ■UL/ANSI Grade: FR-4.0 ■Main Applications: Communication, Automotive, e...
- 用途/実績例
- For more details, please refer to the PDF document or feel free to contact us.
Special Technology Flat Through Hole (Pad On Via Hole)
- 概要
- 【Features】 〇 Flattening of surface mount pads by partial filling only in the BGA/CSP area (supports up to 0.35mm pitch) 〇 Permanent filling ...
- 用途/実績例
- 【Applications】 〇 Printed circuit boards (multilayer boards, BGA/CSP high-density boards, flat through-holes, aluminum boards, and other spec...
Printed Circuit Board Specifications
- 概要
- 【Other Printed Circuit Board Specifications】 <Manufacturable Layers and Board Thickness> ■ Layers: Single-sided, Double-sided, Multi-layer (...
- 用途/実績例
- For more details, please refer to the PDF document or feel free to contact us.
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スクリーンプロセス
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