We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Wiring Board.
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Wiring Board - Company Ranking(33 companies in total)

Last Updated: Aggregation Period:Nov 26, 2025〜Dec 23, 2025
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Company Name Featured Products
Product Image, Product Name, Price Range overview Application/Performance example
【R-1766 Specifications (Partial)】 ■Substrate Manufacturer: Panasonic ■UL/ANSI Grade: FR-4.0 ■Main Applications: Communication, Automotive, e... For more details, please refer to the PDF document or feel free to contact us.
【Features】 〇 Flattening of surface mount pads by partial filling only in the BGA/CSP area (supports up to 0.35mm pitch) 〇 Permanent filling ... 【Applications】 〇 Printed circuit boards (multilayer boards, BGA/CSP high-density boards, flat through-holes, aluminum boards, and other spec...
【Features】 ■ High-Difficulty Fine Patterns - Pad Pitch: 0.5mm - Outer Layer L/S: 60/70μm - Maximum Board Thickness: 1.6t - Pad D... For more details, please refer to the PDF document or feel free to contact us.
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  1. Featured Products
    <Super Short Delivery Time> Base Material Specification Sheet<Super Short Delivery Time> Base Material Specification Sheet
    overview
    【R-1766 Specifications (Partial)】 ■Substrate Manufacturer: Panasonic ■UL/ANSI Grade: FR-4.0 ■Main Applications: Communication, Automotive, e...
    Application/Performance example
    For more details, please refer to the PDF document or feel free to contact us.
    Special Technology Flat Through Hole (Pad On Via Hole)Special Technology Flat Through Hole (Pad On Via Hole)
    overview
    【Features】 〇 Flattening of surface mount pads by partial filling only in the BGA/CSP area (supports up to 0.35mm pitch) 〇 Permanent filling ...
    Application/Performance example
    【Applications】 〇 Printed circuit boards (multilayer boards, BGA/CSP high-density boards, flat through-holes, aluminum boards, and other spec...
    Direct Imaging SystemDirect Imaging System
    overview
    【Features】 ■ High-Difficulty Fine Patterns - Pad Pitch: 0.5mm - Outer Layer L/S: 60/70μm - Maximum Board Thickness: 1.6t - Pad D...
    Application/Performance example
    For more details, please refer to the PDF document or feel free to contact us.